[成都]德州仪器半导体制造（成都）有限公司

职位：Die Attach Engineer 芯片贴装工程师
发布时间：2024-02-05
工作地点：成都
信息来源：前程无忧(51JOB)
职位类型：全职
职位描述
福利:五险一金 餐饮补贴 年终奖金
职能类别:封装工程师
Job Responsibility:
1. Die Attach development & characterization, qualification, and production pilot run to improve package performance on quality, cost, reliability and application.
2. Develop and industrialize Die Attach process including equipment, process technology, glue, soft solder, DAF and flip-bond die attach for new packages, introduce materials to meet the quality, cost, yield and mission of new application.
3. Support Assembly of engineering sample for new packages or new technologies.
4. Define, plan and execute technology roadmap to meet die attach packaging roadmaps.
5. Translate business / industry needs into Die Attach development. Collaborate with other functional groups both locally and globally on development and release to production in factory.
6. Provide technical support related to Die Attach material / process / equipment.

Requirements:
1. Bachelor degree and above.
2. Major in Engineering/ Mechanical / Electrical / Electronics / Microelectronics / Semiconductor Technology, Material Science , Physics, Chemical or Machinery.
3. Statistical data analysis, analytical and problem-solving skills especially,
4. Practice high performance behavior and team work during development, strive for excellent.
5. Self-motivated, ability to work independently and self-initiative personality.
6. Possesses good communication skills, interpersonal skills, and ability to work with global cross functional teams.

Preferred Qualifications:
1. 1~2years Die Attach process engineering experience is preferred
2. Knowledgeable and hands-on in Die Attach equipment operation; ASM Die Attach tool operation experience is preferred
3. Knowledge on Die Attach material characteristics is preferred.
4. Experience in QFN/SOT packaging technology is preferred.
5. Systematic problem solving methodology e.g. DOE, 8D, DMAIC, Process Mapping, Fish Bond etc. is preferred,
6. Ability to anticipate issues and challenges and resolving them quickly, good knowledge and skills in production area is preferred,
7. Familiarity with JMP statistical analysis software is an added advantage.
Skills
1. English capability in speaking, communication, writing and reporting
2. Good to interact with others.
3. Able to work independently and in a group with capability to drive group to establish goal/results.
4. Good at Microsoft Software: power point, excel and outlook. 公司简要介绍：
公司名称:德州仪器半导体制造（成都）有限公司
公司类型:外资（非欧美）
公司规模:1000-5000人
公司介绍:美国德州仪器公司(Texas Instruments)是世界上***的半导体公司之一，致力于提供创新的半导体技术，帮助客户创造世界上先进的电子产品。TI的模拟、嵌入式处理器和无线技术已经渗透到人们日常生活的方方面面，涵盖了从通信、数字娱乐、医疗服务、汽车系统到能源利用的广泛领域。您打出的每一通电话、进行的每一次网络连接、拍的每一张相片、看的每一场电影，TI的技术都蕴含其中。
2010年10月，TI宣布在四川省成都市高新技术产业开发区设立其在中国大陆的***家制造基地，成立德州仪器半导体制造（成都）有限公司。成都制造基地是TI全球***端到端，集晶圆制造、封装测试、凸点加工、金属镀膜于一体的世界级制造基地，它将进一步提升TI的全球生产规模，更好地保证客户供货的连续性，有力地支持客户的业务增长。
TI致力于与本地人才共同成长，并且为每一位入职员工提供国际化的视野、全面的培训体系、广阔的发展机会（技术管理双通道）、舒适的工作环境、丰富的员工活动；携手TI，实现您的人生目标。