[深圳]泛林半导体（上海）有限公司

职位：Field Process Engineer (应届生)
发布时间：2024-04-11
工作地点：深圳
信息来源：前程无忧(51JOB)
职位类型：全职
职位描述
福利:五险一金 专业培训 年终奖金 定期体检 交通补贴 补充医疗保险 补充公积金 股票期权 餐饮补贴 通讯补贴
职能类别:半导体工艺工程师
Responsibilities:
Technical
Responsible for completion of process support and installation of Lam equipment at customer sites. This includes evaluation and documentation of process outputs of hardware modifications/upgrades to existing systems.
Work with senior engineers and customers to understand customer technology roadmaps, process flow, inflection points, requirements and business issues/ challenges.
Key field support role for Beta sites, evals or first in fab installations.
Field owner to drive and resolve process/system
for related escalations and quality investigations.
Setup and complete experiments, collect data, generate and analyze reports for both internal and external distribution and provide recommendations. Develop processes for new applications at customer sites on existing Lam equipment.
Define roadmaps to meet requirements, goals and milestones for new technology process supporting existing processes, correcting process deviations through root cause analysis.
Develop new or modified processes, define best known method process recipes, and work closely with the hardware engineering team to define chamber requirements and characterize hardware designs that meet customer performance requirements.
Design statistical experiments and analyze results to optimize device architecture and/or process modules to ensure the identification and resolution of process and defect issues and communicate results across the organization.
Deliver robust solutions to development needs in conjunction with development engineering groups.
Provide technical support to field engineers, technicians, and product support personnel who are diagnosing, troubleshooting, repairing and debugging complex electro/mechanical equipment, computer systems, complex software, or networked and/or wireless systems.
Present technical and marketing materials to a high standard.
Any other duties as assigned by the immediate supervisor.
Customer Relation
Professionally represent the company to the customer. Utilize knowledge of company’s product lines and services to keep existing / potential customers informed when new/additional needs are identified.
Work closely with customer to understand customer issues and demands.
Initiate process projects and manage customer and product group to drive to closure.
Leadership
Own customer/site KPIs. Provides technical instruction and leadership on installs, repairs, operations and calibration.？ Coordination of application of new procedures.
Provide on-site instruction to sub-contractors and customers.
Work closely with FSE on complex problems which impact process output
Execute fundamental engineering design and analysis with supervision.？
Coordinates statistical analysis of failure rates and develops CIP
Provide input to Lam Management on the strengths, weaknesses, opportunities and threats of and for Lam products？
Work closely with Field Service, Tech Support, Sales and Corporate Engineering as well as customers to understand customer issues and demands in order to anticipate and report those to set objectives and procedures to achieve the need.
Advise to effect design changes. Regularly contributes to key technical solutions, technology and process development.？ Monitors/analyses equipment performance trends
Exercise considerable latitude in determining technical objectives and resources.
Be recognized within a region and/or business unit as having significant technical expertise in one or more Lam systems/applications 公司简要介绍：
公司名称:泛林半导体（上海）有限公司
公司类型:外资（欧美）
公司规模:500-1000人
公司介绍:泛林集团 (Lam Research)于1980年成立于美国，总部位于加利福尼亚州弗里蒙特市，是全球半导体产业创新晶圆制造设备及服务主要供应商。在薄膜沉积、等离子刻蚀、光阻去除、晶圆清洗等前道工艺以及后道的封装应用方面，泛林提供了市场领先的产品和方案组合。
从智能手机、平板电脑，到可穿戴设备和汽车，如果不使用半导体支持的器件，它们的运行时间很难超过几个小时。半导体行业触及地球上几乎每一个人，芯片制造商们仍在持续推进其背后的技术。
作为全球领先半导体公司值得信赖的合作伙伴，我们无惧挑战，努力交付。正因此，当今几乎每一块芯片的制造都使用了泛林集团的技术。
我们创新的晶圆制造设备和服务助力芯片制造商构建体积更小、性能更佳的器件。我们出色的系统工程、技术领导力、以及基于强大的核心价值观的企业文化，都与对客户的坚定承诺紧密结合。

泛林集团于1994年进入中国大陆市场。27年来，泛林集团一直致力于支持中国大陆客户的成功。截至2022年底，我们在中国大陆共设有16个办事机构，拥有将近1100名员工。2022年泛林集团在中国大陆的营收总额约55亿美元。
16家办事机构位于：北京、上海、武汉、无锡、西安、大连、厦门、南京、合肥、青岛、成都、广州和绍兴。
泛林集团为客户提供了许多半导体晶圆制造和研发所需的刻蚀、薄膜沉积和清洗等关键设备。泛林集团战略的核心是通过投资向客户提供持续的支持。2019年1月，泛林集团在中国大陆成立培训中心，开设了刻蚀和沉积技术的相关培训课程。随着增加在中国的培训资源，泛林集团将全面提升对客户的支持，积极助力客户成功。