[天津]恩智浦（中国）管理有限公司

职位：Assembly Process Innovation Engineer
发布时间：2026-06-24
工作地点：天津
信息来源：前程无忧(51JOB)
职位类型：全职
职位描述
职能类别:封装工程师
Responsibilities:
- GTI-PI-API (Global Technology Innovation- Packaging Innovation-Assembly Process Innovation) is a research and development engineering team responsible for the design, development, execution, and/or implementation of packaging product, structures, or assembly process technologies. Investigates the feasibility of applying scientific and engineering principles and emerging technologies and capabilities to potential semiconductor packaging and assembly process offerings. Then, effectively develops or designs the implementation of these into manufacturing. Maintains substantial knowledge of state-of-the-art principles and theories and may contribute to scientific literature and conferences. May also participate in development of patent applications. Maintains an understanding of the semiconductor market and effectively translates market requirements to packaging.
- API Tianjin department is focusing on IC package/process development. Major projects include development work on leadframe based and laminate based packages.

Qualifications:
- Master and PhD are preferred. Or bachelor degree with at least 1 year experience in packaging industry.
- Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
- At least CET-4 degree or equivalent English level and CET-6 is preferred.
- Intention and capability to work in a cross-functional/global team environment.
- Independent R&D capability.

Preference:
- Experience in material analysis: EDX/SEM, AES, SIMS etc.
- Excellent English communication skill.
- Project management and team management experience in industry or in university social activities.
- Statistic analysis knowledge, 6Sigma GB/BB is preferred. 公司简要介绍：
公司名称:恩智浦（中国）管理有限公司
公司类型:外资（欧美）
公司规模:150-500人
公司介绍:恩智浦（中国）管理有限公司，公司规模为150-500人，公司类型为外资（欧美），所属行业为电子技术/半导体/集成电路。