[上海]恩智浦（中国）管理有限公司

职位：Hardware Product Engineer Intern
发布时间：2024-11-04
工作地点：上海
信息来源：前程无忧(51JOB)
职位类型：全职
职位描述
职能类别:硬件工程师
Responsibilities:
1.Responsible for ensuring products meet all mechanical requirements, including boards, cables, enclosures and systems
2.Develop new socket for silicon test based on test requirements, such as, reliability socket, silicon validation socket, FA socket, etc
3.Design new package for NPI product packing
4.Collaborate with design engineer, CAD Layout and test engineer to release system solutions that adhere to DFM guidelines and meet schedule requirements
5.Review layout requirements, layout, Gerber, and BOM data to ensure component population is accurate and corresponds to contract manufacturer (CM) processes, industry standards and compliance
6.Incorporate with CM production line equipment, process capability to perform DFM review activity to optimize layout components placement
7.Generate Change Orders and Corrective Actions to release product engineering data for NPI and sustaining products. Changes should incorporate feedback from contract manufacturers (CMs). Release board assembly instructions documents to guide CM assemble board, assemble board with enclosures, take caution on some key points during assembly
8.Responsible for identifying and communicating manufacturing risks & resolutions to BL partners and project team. Perform board assembly feasibility & risk analysis for specific board assembly process from BL TRD (technical requirements), such as press-fit, ultrasonic clean, conformal coating, underfill process
9.Be familiar with PCB assembly process, such as SMT, de-panel, wave solder/selective wave solder, press-fit, conformal coating, underfill, etc
10.Perform First Article and incoming inspection for PCBA & mechanical parts and assemblies
11.Interact with CMs to resolve assembly and manufacturing issues, improve yields for NPI and sustaining products
12.Ensure engineering data is complete and approved by all stakeholders and input build packages into Aras manufacturing database for each product release
13.Comprehensive knowledge of BOM structure and change control processes
14.Work cross functionally to ensure the resolution of problems and actions as needed

Requirements:
1.Bachelor or Master’s degree in electronics, product & industrial design, mechanical design or related field
2.Experience in one or more of the following areas is a plus: PCB fabrication, PCB assembly, PCB DFM/DFA, Component Engineering, Mechanical Design, Thermal Simulation, Product Lifecycle Management
3.Experience with CAD software such as AutoCAD, Solidworks, Pro-E, CAM350, Allegro, Graphicode, etc. is a plus
4.Excellent interpersonal and communications skills, English proficiency, good teamwork adaptability, self-motivation 公司简要介绍：
公司名称:恩智浦（中国）管理有限公司
公司类型:外资（欧美）
公司介绍:恩智浦是全球领先的半导体解决方案供应商，前身是荷兰飞利浦公司的半导体事业部，拥有超过60年的专业技术及经验，总部位于荷兰埃因霍温。在全球逾30多个国家设有业务机构，员工达34,000人，2023年全年营业收入132.8亿美元。作为全球领先的嵌入式应用安全连接解决方案领导者，恩智浦不断推动着安全互联汽车、端对端安全及隐私、智能互联解决方案市场的创新，并在汽车电子、人工智能、工业物联网、通信基础设施等领域居全球芯片行业领导地位。 2015年，恩智浦收购了美国飞思卡尔半导体，成为全球***的汽车电子供应商之一，产品被全球主流汽车制造商所采用，并引领着自动驾驶、安全互联汽车的技术创新。恩智浦也是5G、移动设备、物联网(IoT)、机器学习、人工智能等新兴技术方面领先的企业，全球客户超过26000家。此外，恩智浦拥有世界一流的无线技术产品组合，并提供涵盖广泛应用的嵌入式安全芯片解决方案，为万物互联时代的终端设备提供安全底层架构。 1986年，恩智浦半导体以荷兰飞利浦公司半导体业务部的前身在中国设立办事处并开展业务，至今已在华深耕38年。恩智浦目前在上海、北京、深圳、苏州及其他十四个城市设立了分公司或办事处，在上海设有大中华区地区总部，在国内拥有六座研发中心，在天津设有一座技术领先的封装测试工厂，并与多家中国企业建立了合资公司，大中华区员工总数超过9000人，其中研发人员超过1600人。 在中国发展30多年来，恩智浦和中国本地合作伙伴紧密合作，在设计、生产、应用开发等领域加速本地化步伐并取得了显著的成效，助推人工智能、物联网、自动驾驶领域发展，为中国实体经济和数字经济融合作出贡献。作为全球领先的汽车电子供应商，恩智浦与中国汽车行业建立广泛而深入的合作，通过领先技术和行业经验推动中国安全智能网联汽车行业发展，先后与包括广汽、上汽、长安汽车、长城汽车、蔚来、小鹏等领先车企建立了战略合作。凭借在安全移动支付领域的领先技术和生态链资源，与包括小米、Oppo、联想等中国领先的手机厂商在移动支付、公交支付领域开展深入合作，实现了移动公交支付在中国200个城市的普及和应用。