岗位职责：
1.Process Technology Development:
1）Develop, qualify, and optimize assembly processes for NAND Flash packaging (such as BGA, CSP, HBM, HBF, multi-die stacks product…).
2）Collaborate with function team & supplier on new material/machine/method research and introduction to fulfill next-generation products or solve exited problems
2.Module Excellence:
1）Research & solve technical challenges by using innovation & breakthrough ideas.
2）Conduct DOE (Design of Experiments) to refine process parameters for high process capability & high product performance.
3.New Process/Product Introduction:
1）Collaborate with function team to ensure new product/process on schedule delivery.

岗位要求：
1）Master’s degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and Chemistry Engineering, or other simi-conductor related field.
2）Has independently published papers or patents.
3）Has led or participated in major projects.
4）Priority if have relevant internship experience in the electronics or semiconductor industries
5) Good English skill, both written and oral.
6) Strong self-learning motivation, and excellent communication and teamwork skills.