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职位描述
PCB电镀表面处理
Job Purpose:
Promote timely response to key Asian customer's technical requirements, such as high level trouble Shooting, new product launches and finish Joint Development Programs activities with R&D and Project team.
Job Responsibilities:
1. Provide application development and laboratory analysis support to Asia CS(circuitry solution) business units.
2. Collaborate with Global R&D on joint projects for new product/process development, with a focus on scale-up testing and application advancement.
3. Deliver high-quality samples to meet customer requirements for product/process certification, ensuring alignment with business objectives.
4. Bridge R&D expertise by translating application knowledge to internal and external customers.
5. Deliver advanced technical support to strategic/key customers.
6. Perform root-cause failure analysis to address technical issues raised by internal and external stakeholders.
7. Develop and conduct technical training programs for internal teams and external customers.
8. Support assigned application projects, including metallization, ICS, DM, and final finishes.
9. Collaborate with laboratory team for ISO17025 support.
Requirements:
• Master's degree in Chemistry/Chemical Engineering or related fields.
• Previous working experience in PCB/IC substrate for Copper plating or Surface treatment.
• Knowledge of PCB industry and manufacturing process.
• Strong organisational and time management skills, ability to work in a fast-paced, adapt to changing priorities and demands.
• Good language skills including written and spoken English.