This is Hong Kong based position at MPS, located in Hong Kong Science Park (HKSP).

Job Summary:
Develop new package type and package structure.

Responsibilities:
1. Survey new material to meet new package processes, reliability, and cost requirements.
2. Collect packaging information/requirement from TME/DE/Marketing/Competitor for next generation package development.
3. Sum up the experience of package design & process, and maintain package design rules & update package road map.
4. Perform other tasks assigned by supervisor.

Qualifications:
1. Package or Power Electronics Major Doctor’s degree.
2. Good knowledge of package development principles.
3. Knowledge of semiconductor supply chain, familiar with assembly sub-contractors, and packaging material vendors.
4. Fluent in spoken and written English.
5. Familiar with AutoCAD or Cadence software is a plus.