This is Hong Kong based position at MPS, located in Hong Kong Science Park (HKSP).

Job Summary:
1. The candidate will drive innovation and performance improvement in key materials such as epoxy, molding compounds, and underfill materials.
2. A main responsibility will be to develop and qualify 2nd source suppliers domestically, ensuring a resilient, cost-effective, and high-quality supply chain for advanced semiconductor packaging.

Responsibilities:
1. Lead the research and development of next-generation packaging materials, including but not limited to: Epoxy die-attach adhesives, Molding compounds for fan-out, SiP, and other advanced packages, underfill materials.
2. Define material specifications, performance targets (thermal, mechanical, electrical, reliability), and qualification plans.
3. Conduct deep-dive technical analysis on material properties, failure mechanisms, and process compatibility.
4. Perform other tasks assigned by supervisor.

Qualifications:
1. PhD degree in Materials Science, Chemical Engineering, Polymer Science, Chemistry, or a closely related field.
2. Deep expertise in chemistry, formulation, processing, and failure modes of key packaging polymers.
3. Strong experience in material characterization techniques (TGA, DMA, rheology, etc.) and reliability testing (MSL, TCT, HAST, etc.).
4. Fluent in spoken and written English.